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| www..com MBR0530T1, MBR0530T3 Preferred Devices Surface Mount Schottky Power Rectifier Plastic SOD-123 Package The MBR0530T1/3 uses the Schottky Barrier principle with a large area metal-to-silicon power diode. Ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. This package also provides an easy to work with alternative to leadless 34 package style. These state-of-the-art devices have the following features: Features http://onsemi.com SCHOTTKY BARRIER RECTIFIER 0.5 AMPERES 30 VOLTS * * * * * * Guardring for Stress Protection Low Forward Voltage 125C Operating Junction Temperature Epoxy Meets UL 94, V-0 @ 0.125 in Package Designed for Optimal Automated Board Assembly Pb-Free Packages are Available Mechanical Characteristics * Reel Options: * * * * * SOD-123 CASE 425 STYLE 1 MBR0530T1 = 3,000 per 7 in reel / 8 mm tape Reel Options: MBR0530T3 = 10,000 per 13 in reel / 8 mm tape Polarity Designator: Cathode Band Weight: 11.7 mg (approximately) Case: Epoxy, Molded Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Rating Symbol VRRM VRWM VR IF(AV) IFSM Value 30 Unit V MARKING DIAGRAM B3 M G G B3 = Device Code M = Date Code G = Pb-Free Package (Note: Microdot may be in either location) MAXIMUM RATINGS ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR, TL = 100C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage Temperature Range Operating Junction Temperature Voltage Rate of Change (Rated VR) ESD Rating: Machine Model = C Human Body Model = 3B 0.5 5.5 A A Preferred devices are recommended choices for future use and best overall value. Tstg TJ dv/dt -65 to +150 -65 to +125 1000 > 400 > 8000 C C V/ms V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. (c) Semiconductor Components Industries, LLC, 2006 1 May, 2006 - Rev. 4 Publication Order Number: MBR0530T1/D MBR0530T1, MBR0530T3 THERMAL CHARACTERISTICS Rating Thermal Resistance - Junction-to-Ambient (Note 1) Thermal Resistance - Junction-to-Lead Symbol RqJA RqJL Value 206 150 Unit C/W C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 2) (iF = 0.1 Amps, TJ = 25C) (iF = 0.5 Amps, TJ = 25C) Maximum Instantaneous Reverse Current (Note 2) (Rated DC Voltage, TC = 25C) (VR = 15 V, TC = 25C) 1. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2%. vF 0.375 0.43 IR 130 20 mA V iF, INSTANTANEOUS FORWARD CURRENT (AMPS) 104 I R, REVERSE CURRENT ( A) 1 TJ = 125C 1000 TJ = 125C 0.1 75C 25C -40 C 100 75C 10 25C 0 5 10 15 20 25 30 35 40 1 0.01 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 vF, INSTANTANEOUS VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current 180 160 C, CAPACITANCE (pF) 140 120 100 80 60 40 20 0 5 10 15 20 25 30 TYPICAL CAPACITANCE AT 0 V = 170 pF VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Capacitance http://onsemi.com 2 MBR0530T1, MBR0530T3 P F(AV), AVERAGE POWER DISSIPATION (WATT) 1 AVERAGE FORWARD CURRENT (AMP) 0.875 0.75 0.625 0.5 0.375 0.25 0.125 0 60 SQUARE WAVE =p =5 = 10 Ipk/Iav = 20 67 74 81 88 95 102 109 116 123 130 DC 0.35 0.315 0.28 0.245 0.21 0.175 0.14 0.105 0.07 0.035 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Ipk/Iav = 20 = 10 =5 TJ = 125C =p SQUARE WAVE DC LEAD TEMPERATURE (C) IF(AV), AVERAGE FORWARD CURRENT (AMP) Figure 4. Current Derating (Lead) Figure 5. Power Dissipation ORDERING INFORMATION Device MBR0530T1 MBR0530T1G MBR0530T3 MBR0530T3G Package SOD-123 SOD-123 (Pb-Free) SOD-123 SOD-123 (Pb-Free) Shipping 3000 / Tape & Reel 3000 / Tape & Reel 10,000 Tape & Reel 10,000 Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 3 MBR0530T1, MBR0530T3 PACKAGE DIMENSIONS SOD-123 CASE 425-04 ISSUE E D A A1 HE 2.36 0.093 4.19 0.165 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 4 EE EE EE EE EE EE AAAA AAAA AAAA 2 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. MILLIMETERS DIM MIN NOM MAX A 0.94 1.17 1.35 A1 0.00 0.05 0.10 b 0.51 0.61 0.71 --- --- c 0.15 D 1.40 1.60 1.80 E 2.54 2.69 2.84 HE 3.56 3.68 3.86 --- --- L 0.25 STYLE 1: PIN 1. CATHODE 2. ANODE MIN 0.037 0.000 0.020 --- 0.055 0.100 0.140 0.010 INCHES NOM 0.046 0.002 0.024 --- 0.063 0.106 0.145 --- MAX 0.053 0.004 0.028 0.006 0.071 0.112 0.152 --- E L C b SOLDERING FOOTPRINT* 0.91 0.036 1.22 0.048 SCALE 10:1 mm inches MBR0530LT1/D |
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